EVOLUTION OF CO PACKAGED INTERCONNECTS

Silicon-germanium technology for optical interconnects

Silicon-germanium technology for optical interconnects

Silicon Germanium (SiGe) BiCMOS has a long track record of serving high-speed optical interconnect applications since the start of the Ethernet Gb/s era. Enabling higher per‑lambda (λ) data rates, optical I/Os and packaging‑aware integration, GF's silicon photonics solutions are redefining how bandwidth scales in next‑generation scale‑up and scale‑out architectures. Artificial intelligence (AI) has become a transformative force across various industries, driving innovation and eficiency, but it's crucial to consider the sustainability of these advancements to ensure long-term benefits for society and the environment. The platform viability is experimentally and theoretically investigated through the realization of main building blocks of passive circuitry. integration of optical data communication with electrical data computing via Si complementary metal–oxide–semicon-ductor (CMOS) technology could revolutionize information technology. To meet the unprecedented demands for data transmission speed and bandwidth silicon integrated photonics that can generate, modulate, process and detect light signals is being developed.

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