Passive Optical Module Coupling Method

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We discuss the fabrication of an optical PC board (OPCB) made of molded, polymeric material with sub-micron mechanical fiduciaries that will enable passive, pick and place coupling of diverse optical components and single mode fibers. At Fraunhofer IZM, a wide variety of fiber optical components have been developed in response to growing demand in communication, sensing, healthcare, and other semiconductor laser applications. A low-cost packaging method utilizing a fully passive optical alignment and surface-mounting method is demonstrated for pluggable compact and slim multichannel optical interconnection modules using a VCSEL/PIN-PD chip array. The aim is to broaden the application of photonic integrated circuits (PICs) from traditional fiber optic communication systems. V-grooves are created on the surface of the PIC die and features are created on the FAU to extend from the FAU into the respective V-grooves.

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PHOTONIC SYSTEMS

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EP4485027A1

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